18 School of SCIENCE Vision To be a global leading facilitator for enlightening creative minds and fostering visionary talents, and to develop scientific knowledge, offer engineering methodologies, and solve cross-disciplinary problems. Mission To serve as a platform for merging individual technologies together and implement their integrated functionality at the systems level, and to disseminate impactful technologies to the Greater Bay Area and explore relevant industrial or societal applications. The Systems Hub hosts a cluster of cross-disciplinary thrust areas in Bioscience & Biomedical Engineering (BSBE), Intelligent Transportation (INTR), Robotics & Autonomous Systems (ROAS), and Smart Manufacturing (SMMG). Based on the fundamental research in various technical fields, the Systems Hub will facilitate the integration of multidisciplinary technologies and explore their applications. In addition to theoretical framework and experimental validation, computational modeling and simulation will be emphasized as well. Research highlights of the Systems Hub include, but are not limited to, molecular medicine and implanted devices, information fusion from multiple traffic sensing modalities, personal assistive robotics and human-robot interaction, implementation of Industry 4.0 and additivemanufacturing. Systems Hub Prof. Ricky Shi-Wei LEE Chair Professor Acting Dean of Systems Hub, HKUST(GZ) Research Interest • Additive Manufacturing • Heterogeneous Integration • Packaging of Microsystems • Electronics and Optoelectronics Packaging Acting Dean Prof. Ricky Lee received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University in 1992. After one year of post-doctoral research at Purdue, he joined the Hong Kong University of Science & Technology (HKUST). During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute for two and a half years. Currently Dr Lee is Chair Professor of Smart Manufacturing Thrust and Acting Dean of Systems Hub at the HKUST Guangzhou Campus HKUST(GZ). He also has concurrent appointments as Executive Director of Shenzhen Platform Development Office, Director of Electronic Packaging Laboratory, and Director of Foshan Research Institute for Smart Manufacturing at HKUST. Dr Lee has been focusing his research on the technology development for electronics/optoelectronics packaging and additive manufacturing. The topics of his R&D interests include wafer level packaging and heterogeneous integration, 3D printing for microsystems packaging, LED packaging for solid-state lighting and applications beyond lighting, leadfree soldering and reliability analysis. The research outcomes of Dr Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored 4 books and 10 book chapters. Due to his technical contributions, Dr Lee has received many honors and awards over the years. In addition to being the recipient of 15 best/outstanding paper awards and 7 major professional society awards, Dr Lee is Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK). He is also Editor-in-Chief of ASME Journal of Electronic Packaging. wechat
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