School of Engineering Department of Mechanical and Aerospace Engineering 157 Smart Cushion Supervisor: YU, Hongyu / MAE Student: WUN, Ga Yun Esther / MECH Course: UROP3100, Spring Flexible printed circuit boards (FPCBs) are increasingly popular in the electronics industry due to their flexibility and lightweight. This report presents ANSYS simulation results of the stretching process for the Kirigami-patterned FPCB used in the Smart Cushion system. The FEA tools ANSYS was used to simulate the stretching process and analyze the deformation and stress distribution of the Kirigami-patterned FPCB. The simulation results indicated that the Kirigami-patterned FPCB substrate may experience a fracture at the polyimide (PI) layer. However, it should be noted that simulations may have limitations and are less accurate in simulating processes such as folding for FPCBs, and thus experimental testing should be conducted for comparison.
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