School of Engineering Department of Electronic and Computer Engineering 151 Nano/Microfabrication Technologies for Microelectronic Supervisor: YANG Yansong / ECE Student: KUI Ka Yu / CPEG Course: UROP 1100, Summer This report outlines my experience and learnings during a UROP1100 project, which focused on Nano/microfabrication technologies for microelectronics. I am enthusiastic about this field and eager to contribute, therefore I joined this project. The project aims to investigate various nano/microfabrication techniques, including electron-beam lithography, plasma dry etching, and material deposition, for the fabrication of novel micro-devices for signal processing applications. I received a comprehensive training from the Nanosystem Fabrication Facility (NFF), which covers essential aspects such as chemical safety, cleanroom protocols, and the use of specialized equipment. This report will describe my challenges during the learning process, particularly the challenges faced in understanding process flows and mastering the nuances of contamination control. With the guidance of professors and through hands-on experience, I was able to overcome these obstacles and successfully complete the required training and assessments. Nano/Microfabrication Technologies for Microelectronic Supervisor: YANG Yansong / ECE Student: MENG Tianxi / ELEC Course: UROP 1100, Spring UROP 2100, Summer Wafer bonding plays an important role in heterogeneous integration. It means the attachment of two or more substrates or wafers to one another through a range of physical and chemical processes. With the development of technology, more and more bonding techniques have been invented and they can mainly be divided into two categories: bonding with intermediate layers and direct bonding. This review briefly introduces several bonding techniques and it mainly focuses on the introduction of thermo-compression metal bonding. This review aims to build the recipe of the bonder in NFF based on previous articles. Nano/Microfabrication Technologies for Microelectronic Supervisor: YANG Yansong / ECE Student: MIU Victor / CPEG Course: UROP 1100, Fall This report presents my learning outcome of participating in the Undergraduate Research Opportunity Program (UROP) project focused on nano/micro fabrication technologies for microelectronics. The objective in this fall semester was to get access to equipment in the Nanosystem Fabrication Facility (NFF) for doing further research and gain some hands-on experience for the fabrication process. In this stage of the program, the project was more focused on photolithography and etching process, so all the equipment I learned is involved in these two kinds of process. The results and experience obtained will be useful in further learning of design and other microelectronic fabrication experiments. This report summarizes the equipment I learned and the results of my photolithography experiments in this fall semester.
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