School of Engineering Department of Electronic and Computer Engineering 176 Nano/Microfabrication Technologies for Microelectronic Supervisor: YANG Yansong / ECE Student: JUELS Titan Harold / CPEG Course: UROP 1100, Fall The goal of this UROP project was to gain the necessary certifications for working in the Nanofabrication Facility (NFF) and to develop the foundational skills required for fabricating nano-devices. Over the course of the semester, certifications were obtained after the completion of safety and technical training, enabling operation within a cleanroom environment. Standard safety protocols and equipment handling procedures were learned to ensure compliance with NFF laboratory standards. The project also involved understanding the end-to-end process of research and development in integrated circuit (IC) technology. Advanced fabrication techniques, including lithography, etching, and deposition, were explored to create and test nano-devices. Specific steps in the fabrication workflow were optimized to improve device performance and reliability. Through this experience, the relevant dangers within the clean room were understood, and the countermeasures were learned. Hands on experience was also gained, allowing me to comprehend the risks associated with Nanofabrication, whilst preparing me for beginning my research journey. Nano/Microfabrication Technologies for Microelectronic Supervisor: YANG Yansong / ECE Student: KIM Semin / ELEC Course: UROP 1000, Summer The goal of this study is to build foundational knowledge for further projects by understanding essential concepts of RF filters and gaining familiarity with COMSOL Multiphysics. Therefore, this report reviews the evolution of radio frequency (RF) filters and presents a filter model that was created and simulated with COMSOL. The report will begin by focusing on RF filters used from 1G to 5G, including SAW, BAW, LTCC, and IPD. Then, the software functions used to build SAW filter models are briefly explained. Finally, simulation results of two 2D models of the SAW filter will be evaluated based on the knowledge gained from this study. Nano/Microfabrication Technologies for Microelectronic Supervisor: YANG Yansong / ECE Student: MENG Tianxi / ELEC Course: UROP 3100, Spring This is a progress report for the ongoing UROP project. The detailed topic of the project is defined. Heterogeneous integration between different components is studied more and more because of the need for area reduction and performance enhancement. (e.g. A shorter distance can reduce the effect of parasitic inductance/capacitance.) Therefore, the project will focus on the integration between the power amplifier and the filter chip. The learning progress and the plan will also be shown in this report. This report includes the following sections: 1) Literature survey on the microsystem integration of the RF communication system and gold-to-gold wafer bonding 2) Further plan
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